Dimensity 1300 is the new Snapdragon 778G SLAYER! Just look at its specs

Dimensity 1300 is now official as MediaTek’s new high performance chipset. Here are all the details.

| Updated on: Aug 22 2022, 11:24 IST
Dimensity 1300
Dimensity 1300 is now official as the successor to the Dimensity 1200 chipset. (MediaTek)
Dimensity 1300
Dimensity 1300 is now official as the successor to the Dimensity 1200 chipset. (MediaTek)

Dimensity 1300 has just been announced! MediaTek has just unveiled the successor to last year's popular Dimensity 1200 chipset. This chipset is expected to offer a mild performance upgrade over its predecessor and should be in line with the Snapdragon 778G chipset that powers a majority of Android midrange smartphones. MediaTek is yet to announce which phones will be getting the chipset first but rumours suggest a OnePlus device getting it before anyone else.

The Dimensity 1300 is based on TSMC's 6nm fabrication process and features an octa-core processor, comprising of the same 1+3+4 configuration. The Ultra Cortex-A78 core is running at 3GHz whereas the normal performance cores are running at 2.6GHz. The four efficient Cortex-A55 cores are running at 2GHz. MediaTek is using a 9-core Mali-G77 MC9 GPU, which should offer improved performance.

Dimensity 1300 is here

MediaTek says that the Dimensity 1300 can support up to 168Hz refresh rate FHD+ display. The chip can support up to 16GB of LpDDR4X RAM and UFS 3.1 storage. The ISP can support up to 200MP resolution camera sensor and can do 4K HDR videos as well. And of course, it supports 5G networks.

“The Dimensity 1300 boosts AI benchmark scores from the six-core APU 3.0 by up to 10%, giving greater capacity for AI tasks. The MediaTek APU 3.0 features an advanced multi-tasking scheduler to maximize performance and efficiency while handling a wide range of simultaneous tasks,” says MediaTek.

“MediaTek HyperEngine 5.0 provides a comprehensive suite of gaming-related optimizations such as exclusive AI-VRS, Wi-Fi/Bluetooth Hybrid 2.0, plus wireless earbud latency improvements from Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio,” adds MediaTek.

And like last year, MediaTek has opened it up for manufacturers to customise the chip to their specific needs. “Dimensity 5G Open Resource Architecture allows device makers to create unmatched 5G smartphones that truly stand out,” says the press release.

While the Dimensity 1300 breaks cover, there are reports of the Dimensity 8000 series chips making to global markets, including India in the new Xiaomi 12 series devices. Additionally, there have been reports of Samsung considering MediaTek chips for its upcoming Galaxy S22 FE as well as Galaxy S23 series devices across several Asian markets in a bid to keep the prices low.

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First Published Date: 08 Apr, 19:24 IST