Dimensity 9200 to take on Apple A16 Bionic with Cortex-X3 core, ray tracing
Dimensity 9200 announced for Android flagships with the new Cortex-X3 core and ray tracing.
With November not having many big tech announcements, MediaTek has gone ahead and announced its flagship chip for the next generation of Android flagship smartphones. It is called the Dimensity 9200 and promises improved performance and efficiency over the current Dimensity 9000 powering some Android flagship phones. MediaTek is using the updated N4P node for this chip instead of the 3nm node that was expected on this generation of chips.
The Dimensity 9200 will debut in flagship Android smartphones by the end of 2022 and could once again offer a choice of an alternative chip-based flagship device. MediaTek is using the latest ARM cores and other updated components to promise modest performance upgrades. Here's a quick rundown of all the features you will see in phones using the chip.
Dimensity 9200 takes on Apple A16
The Dimensity 9200 is based on the 2nd Gen TSMC N4P node and is using ARM's new Cortex-X3 prime core that is clocked at a maximum speed of 3.05GHz. The core is based on the ARMv9 architecture. Along with the Cortex-X3 core, the CPU also features 3 x Cortex-A715 cores clocked at 2.8GHz and 4X Cortex-A510 cores at 1.8GHz.
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But it doesn't end there. The Dimensity 9200 is using the ARM Immortalis G715 GPU that comes with a hardware-based ray tracing engine. It also brings features such as Variable Refresh Rate Shading, double machine learning.
The Dimensity 9200 also supports up to two 5K resolution displays at 60Hz, WQHD resolution at 144Hz and 1080p resolution at 240Hz refresh rate. This is also the first chipset to support Wi-Fi 7 standard, with up to 6.5Gbps data transfers. Both sub-6Ghz and mmWave 5G connectivity are also on board along with Bluetooth 5.3.
The Dimensity 9200 will take on the soon-to-be-announced Snapdragon 8 Gen 2 chip for flagship Android devices. This one is also expected to use the N4P node and offer better efficiency with the power and thermal management. However, the 3nm node is expected to debut on the Apple A17 Bionic chip.