MediaTek on Wednesday announced the launch of Dimensity 1200 chipset. Shortly after, Realme announced that it will be one of the first smartphone makers to launch a Dimensity 1200-powered flagship smartphone later this year.
Talking about the firsts, Realme said that it has launched many “firsts” in smartphone world equipped with the MediaTek’s Helio series chipsets in the 4G era, with the first to launch Realme C3 equipped with Helio G70, Narzo 10 with Helio G80 and the Realme 7 with Helio G95. The company said that it has been collaborating closely with MediaTek to launch several 5G models including the first brand to launch a 5G smartphone equipped with Dimensity 800U.
Now, the company plans to launch a Dimensity 1200-powered phone that is expected to hit the market towards the end of the first quarter of 2021 and the beginning of the second quarter of the year.
“This year, realme will be one of the first brands to launch a smartphone equipped with the latest generation of MediaTek’s new Dimensity flagship 5G smartphone chip. We will continue to work closely with MediaTek to foster development, adoption and large-scale popularity of 5G around the world," Madhav Sheth, Vice President - Realme and CEO, Realme India and Europe said on the occasion.
MediaTek Dimensity 1200 chipset
It comes with an octa-core CPU designed that clocks up to 3GHz and Arm Mali-G77 MC9 GPU. It has been made using the 6nm process. It is capable of supporting a resolution of 2520x1080 pixels and a maximum refresh rate of 168Hz. It offers up to 16GB of RAM along with a peak download speed of 4.7Gbps and a peak upload speed of 2.5Gbps.
MediaTek said that the Dimensity 1200 supports 200MP photos with staggered 4K HDR video capture for significantly greater dynamic range. It has WiFi 6 and Bluetooth 5.2 for connectivity. It also supports AI camera features such as AI-Panorama Night Shot, AI Multi-Person Bokeh, AI noise reduction (AINR) and HDR capabilities along with AI-enhanced video playback features like AI SDR-to-HDR.
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