The Dimensity 1200 was one of the more powerful and popular smartphone chips last year, powering a couple of midrange and gaming smartphones. MediaTek has now announced successors to the Dimensity 1200. The Dimensity 8000 series claims to offer the same flagship grade performance as the Dimensity 9000 series chips, whereas the Dimensity 1300 is essentially a tweaked version of the older Dimensity 1200.
The Dimensity 8000 series borrows a lot from the Dimensity 9000 chipset, basing itself on the 5nm manufacturing process of TSMC. The more powerful one is the Dimensity 8100 which despite having a conventional core architecture offers as much power as the Snapdragon 888. This one has four performance cores with a slightly higher clockspeed. The Dimensity 8000 gets the conventional four performance core setup for performance. Both these chips have four high-efficiency cores as well.
The Dimensity 8100 uses four ARM Cortex-A78 cores with speeds reaching up to 2.85GHz, and the Dimensity 8000 has four ARM Cortex-A78 cores operating at up to 2.75GHz.
“You could say the MediaTek Dimensity 8000 series is the little brother to our flagship Dimensity 9000 chip. Meaning it brings flagship grade features and next level energy efficiency to the premium smartphone market,” said CH Chen, Deputy General Manager of MediaTek’s Wireless Communications Business Unit.
Both the Dimensity 8000 series chips use ARM Mali-G610 MC6 GPU with MediaTek’s HyperEngine 5.0 gaming technologies, promising up to 170fps for the Dimensity 8100 and 140fps for the Dimensity 8000. Both these chips now have quad-channel LPDDR5 memory and UFS 3.1 storage ensure ultra-fast data streams.
MediaTek has also brought in MediaTek’s Open Resource Architecture to smartphone makers the flexibility to customize and differentiate features. The Dimensity 8000 series integrates MediaTek’s fifth generation AI processing unit, APU 580. The Dimensity 8000 series also uses the Five gigapixel per second image signal processor (ISP) for good photography.
Alongside the Dimensity 8000 series, MediaTek also announced the 6nm Dimensity 1300 an octa-core CPU with an ultra-core ARM Cortex-A78 clocked up to 3GHz, three ARM Cortex-A78 super cores and four ARM Cortex-A55 efficiency cores, along with an ARM Mali-G77 GPU and MediaTek APU 3.0. The Dimensity 1300’s HDR-ISP supports up to 200MP cameras as well.
MediaTek says that smartphones using the Dimensity 8100, Dimensity 8000 and Dimensity 1300 chips will be available in the market in the first quarter of 2022.
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