Intel announces Lakefield chip for foldables, dual-screen PCs

Intel’s Lakefield processors are the first in the market that come with the company’s new 3D chip-stacking tech.

By: HT TECH
| Updated on: Aug 20 2022, 21:20 IST
The tiny Lakefield chip is based on a hybrid CPU architecture that combines power-efficient Tremont cores with 10nm Sunny Cove cores.
The tiny Lakefield chip is based on a hybrid CPU architecture that combines power-efficient Tremont cores with 10nm Sunny Cove cores. (Intel)

Intel announced their latest mobile processors, Lakefield, yesterday. Created for foldables and dual-screen PCs, the Lakefield processors leverage Intel's proprietary Foveros 3D stacking tech.

The tiny Lakefield chip is based on a hybrid CPU architecture that combines power-efficient Tremont cores with 10nm Sunny Cove cores. “Intel Core i5 and i3 processors with Intel Hybrid Technology leverage a 10nm Sunny Cove core to take on more intense workloads and foreground applications, while four power-efficient Tremont cores balance power and performance optimization for background tasks. The processors are fully compatible with 32- and 64-bit Windows applications, helping reach new heights for the thinnest and lightest designs,” Intel explained speaking about the big.LITTLE architecture.

You may be interested in

LaptopsTablets
21% OFF
Acer Swift Go SFG14 41 NX KG3SI 002 Laptop
  • Pure Silver
  • 8 GB RAM
  • 512 GB SSD
39% OFF
Acer Aspire 5 A515 57G Laptop
  • Gray
  • 16 GB RAM
  • 512 GB SSD
22% OFF
40% OFF
Asus VivoBook 15 X515JA BQ322WS Laptop
  • Transparent Silver
  • 8 GB RAM
  • 512 GB SSD

The design of the new processor is divided into three layers that are stacked one on top of the other. In a miniscule 12x12x1 mm form factor, approximately the size of a dime, Lakefield has two logic dies stacked on each other followed by two layers of DRAM in three dimensions in a PoP (package on package). This configuration also eliminated the need for external memory. Lakefield improves on power efficiency (using just 2mW when idle) and offers improved graphic performance.

Also read
Looking for a smartphone? To check mobile finder click here.

Lakefield is expected to take on Qualcomm's 8cx that has been designed for always-on laptops that need long battery life and powerful performance.

Intel announced that Samsung's always-connected laptop, the Galaxy Book S, is going to be the first laptop to ship with the Lakefield SoC. The Galaxy Book S is scheduled to ship out this month in select countries. The Lakefield is also going to power Lenovo's ThinkPad X1 Fold, which is the world's first foldable laptop.

The ThinkPad X1 Fold was announced at CES 2020 and comes with a 13.3-inch screen that can be folded to close the laptop. It should cost a whopping $2,499 when it ships later this year.

Catch all the Latest Tech News, Mobile News, Laptop News, Gaming news, Wearables News , How To News, also keep up with us on Whatsapp channel,Twitter, Facebook, Google News, and Instagram. For our latest videos, subscribe to our YouTube channel.

First Published Date: 11 Jun, 08:58 IST
Tags:
NEXT ARTICLE BEGINS